Hierarchical Chiplets Design in Xpedition Substrate Integrator

Now you can place virtual die model (VDM) at any level of floor planning hierarchy without limitation. This video demonstrates the construction of a multi-substrate system containing several instances of a VDM defined using LEF/DEF. Connectivity is preserved throughout the hierarchy and an ECO comparison update with a DEF revision enables package designers to quick accommodate changes. Learn more have the Xpedition IC Packaging release on