EEVblog #532 - Silicon Chip Wafer Fab Mailbag

A look at some equipment and wafers used in the manufacture of silicon chip wafers. 200mm and 300mm wafers, die, dice sawing, lead-frame manufacture, automated testing machine (ATE) probing, clean room bunnie suits, photo plots, BGA chip thermal test sockets, and the worlds smallest active FET probes at 100 nanometers for direct wafer probing! Thanks to Vincent Himpe: Forum: EEVblog Main Web Site: EEVblog Amazon Store: Donations: Projects: Electronics Info Wiki: Теги: Integrated Circuit (Invention),bunnie suit,cleanroom,cleanroom suit,ate,automated test,wafer,silicon wafer,wafer manufacture,bare die,bare dice,testing,probing,active fet probe,fet probe,bga socket,zif socket,test socket,test probing,chip manufacture,microscope,how it works,tutorial,factory,tour,silicon chip,copper,bonding,bond wires,test card,test head,test system,photo plot