lead-free solder is mostly silver, tin, and sometimes copper or other metals. The temperature required to get a lead-free solder alloy into its molten Pb-free solder materials are used in various parts of interconnections in electronic packages. The first-level interconnectis between the chip and the package substrate and lead-free solder bump material are used in the case of a Flip Chip BGA (FCBGA) Recovery SILVER extracting from BGA chipset #SILVERextracting #SILVERrecovery #BGAchipset
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