Myvideo

Guest

Login

Recovery SILVER extracting from BGA chipset

Uploaded By: Myvideo
1 view
0
0 votes
0

lead-free solder is mostly silver, tin, and sometimes copper or other metals. The temperature required to get a lead-free solder alloy into its molten Pb-free solder materials are used in various parts of interconnections in electronic packages. The first-level interconnectis between the chip and the package substrate and lead-free solder bump material are used in the case of a Flip Chip BGA (FCBGA) Recovery SILVER extracting from BGA chipset #SILVERextracting #SILVERrecovery #BGAchipset

Share with your friends

Link:

Embed:

Video Size:

Custom size:

x

Add to Playlist:

Favorites
My Playlist
Watch Later