China breaks tech limit: EUV lithography not needed to make 1nm chips!

Welcome to VOC - Vision of China, In today’s video, we provide updates on China’s breakthrough in producing 1nm chips without EUV lithography. This significant advancement in the chip manufacturing process has the potential to revolutionize the industry. The lithography machine, a critical device in chip manufacturing, has been a key focus for technological advancements. TSMC’s latest 3nm process relies on EUV lithography for its advanced process technology. Chinese graduate student Jia Di Zhu, from the Massachusetts Institute of Technology (MIT), has achieved a remarkable breakthrough by fabricating atomically thin transistors based on two-dimensional materials at room temperature. These ultra-thin transistors, only three atoms thick, can be stacked to break through the 1nm barrier, enabling the creation of more powerful chips.