What does FPC mean material#fpc #fpccircuit #flexibleprintedcircuit

In the context of materials used in Flexible Printed Circuits (FPCs), “FPC“ refers to the following key materials: Flexible Substrate: Polyimide (PI): This is the most common material used for the substrate due to its excellent flexibility, thermal stability, and electrical insulation properties. Polyimide substrates can withstand high temperatures and mechanical stress. Polyester (PET): Used in some applications where extreme temperature stability is less critical. It is generally less expensive but not as heat-resistant or flexible as polyimide. Conductive Material: Copper: The primary material used for conductive traces. Copper is chosen for its superior electrical conductivity and is typically deposited onto the flexible substrate using techniques such as sputtering or electroplating. Insulating Layers: Polyimide or Other Polymers: These materials are used to cover and protect the conductive traces, providing insulation and protecting against environmental damage. Coverla