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@MakeGold Gold wire bonding is a process used in microelectronics packaging to connect a semiconductor device to a metal lead frame or a substrate. In this process, a thin wire made of gold is used to create the electrical connections between the device and the lead frame or substrate. The gold wire bonding process involves several steps. First, the gold wire is fed through a capillary that is attached to a bonding tool. The tool is then moved to the desired location on the device or substrate, where it makes contact with a bonding pad. Once the bonding tool makes contact with the bonding pad, a high-frequency current is applied to the wire. This current heats the wire and creates a ball at the end of the wire. The bonding tool then presses the ball onto the bonding pad, creating a physical and electrical connection. The wire is then moved to the lead frame or substrate, where the process is repeated to make the final connection. The wire is then cut, and the process is complete.
